R&D Internship in Semiconductor Power Module 80 - 100 % (f/m/d)

Description

In our Semiconductors business unit in Lenzburg, we develop and produce high-performance state of the art semiconductors power module for applications in different fields like rail transportation, power transmission, renewable energy, eMobility and more.

Your responsibilities

• Develop new packaging technologies for power electronics (PE) modules to enable higher current capability, sustain higher temperatures and stresses under harsh environmental conditions

• Support the build-up and characterization of prototypes of IGBT modules for quality assessment using several techniques such as scanning acoustic microscopy, cross-sections, electrical and reliability testing

• Conduct design of experiments (DoEs) to support technology development through process and materials optimization

• Interact and collaborate with a dynamic and multidisciplinary team that will supervise and guide the project

• Use your strong technical background, motivation to develop innovative solutions, and goal-oriented approach to make a significant impact on the project

• Contribute in building a stronger and more sustainable energy future

The duration of the internship is six months.

Your background

• Currently pursuing a degree in material sciences, mechanical engineering, chemistry, physics, or similar discipline (B.Sc. or M.Sc. degree internship and/or thesis)

• Experience in laboratory work and know-how in sample preparation and material characterization techniques

• Know-how in data analysis tools and statistics is advantageous

• Strong problem-solving skills, with the ability to think creatively and independently to resolve technical challenges

• Excellent communication skills, both written and verbal, to effectively document the design and present results to the team

• Fluent in English, German is a plus

• A self-starter with a strong work ethic and the ability to work independently or as part of a team

• Willingness to learn new concepts and technologies related to semiconductor packaging

• Availability 5 – 10 months