Mechanical Packaging Engineer

Description

General Description:

The Design Engineer I candidate will have the opportunity to work in a global and very dynamic team of dedicated professionals. The candidate will be part of Hitachi Astemo’s Mechanical Hardware team.  The team has product design responsibility for mechanical enclosures over multiple controller product lines including Powertrain, Vehicle Dynamics and AD/ADAS controller families.  Our role is to design enclosures which prevent failures from various mechanisms including thermal, chemical, EMC, vibration, shock, fatigue, etc.

Job Responsibilities:

• Design of mechanical packaging for automotive controllers.
• Create and maintain DFMEA, DVP&R, DRBFM and other quality documentation.
• Design of mechanical enclosures utilizing high pressure die cast, stamped and injection molded components.
• Utilization of CAD tools, preferably SolidWorks, for design of 3D models, assemblies, and creation of 2D drawings.
• Perform/Support mechanical, vibration, and thermal FEA, CFD
• Perform/Support Ansys Sherlock solder fatigue analysis.
• Achieve DFM approval from vendors and internal PE groups.
• Work under pressure of short time to deliver product that capture customer requirements.
• Generate technical reports as required.
• Represent Hitachi in all internal and customer support meetings.
• Weekly management status/escalation reporting.
• Conformance to all internal and customer design specifications.
• Support of local DV and PV testing development.
• Maintain mechanical BOM.
• Responsible for creating/delivering/managing internal/customer drawings.
• Execution of project deliverables according to internal and customer milestones.

Qualifications:

• Experience in electronics packaging strongly preferred.
• Experience in controller or connector design is a plus.
• Thermal management experience is a plus.
• Strong background in mechanical design
• Sound mastery of the engineering problem solving methodology.
• Experience in designing high pressure die cast, stamped or injection molded components is a plus.
• Project management skills.
• Strong Microsoft suite skills including PowerPoint, Excel, and Word.
• Ability to communicate with and understand the needs of the cross-functional and teams.
• Strong sense of urgency and personal commitment.
• Possess excellent written and verbal presentation skills.
• Ability to read, analyze and interpret complex documents.
• Highly motivated and disciplined in time management.
• History of delivering designs on time and on budget.
• Experience in managing tiered supply base is a plus.
• Experience in a customer facing support role is a plus.
• Experience with GD&T and Stack ups (Arithmetic and Statistical) is a plus.
• FEA and CFD analysis experience is preferred, especially using ANSYS Suite and Star-CCM+
• Experience with solder fatigue analysis (ANSYS Sherlock, etc.) is a plus.
• Experience working in multi-cultural environments is a plus.

Education: Bachelor’s degree in Mechanical Engineering/Mechatronics or equivalent

Experience: 0-2 yrs applicable experience in mechanical engineering and design..

Job level determined by various factors such as organization size, responsibility, career stage, and capabilities.

Supervisory Responsibilities:  N/A

Working conditions:

Physical Demands:  Able to perform light physical work consistently and lift up to 75 pounds occasionally.

Work Style: Hybrid.  Employee must work on site 3 days per week minimum at our Harrodsburg, KY or Farmington Hills, MI location.

Travel: Domestic and international travel may be required as needed.

Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities

If you need a reasonable accommodation to apply for a job at Hitachi, please send the nature of request and contact information to [email protected]. Queries other than accommodation requests will not be responded to.