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Process Engineer II

Location: Hillsboro, Oregon, United States
Job ID: 45381
Date Posted: Apr 15, 2020
Segment: High-Tech
Business Unit: Hitachi High-Technologies
Company Name: Hitachi High-Tech America, Inc.
Profession (Job Category): R&D
Job Type (Experience Level): Experienced
Job Schedule: Full-time
Remote: No

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Description

GENERAL DESCRIPTION

The Process Engineer II position is located in Portland, Oregon and supports the business objectives of HTA’s Semiconductor Equipment Division (SED).  The main objective of this position is to provide process engineering support to SED’s various demonstration labs, customer activities, and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes.  This is a team leadership position.  Position is expected to be able to manage individual demos with minimal support.  Engineer is expected to develop and optimize a specific process, understand hardware and process interactions, create customer reports, improve understanding by studying external papers and attending conferences, and explain process phenomena based upon plasma physics and chemical/material interactions.  The engineer should be able to create and give presentations at internal and external conferences.  Engineer should be able to perform basic supervisor roles such as training new engineers in the use of toolset, metrology equipment, and other demonstration laboratory procedures.  The engineer is interfacing with engineers globally so strong interpersonal skills are required.  The employee must be willing to travel to Japan for specific project and process development as necessary. 

 

 

PRIMARY RESPONSIBILITIES

·       Day-to-Day responsibilities include: completing all tasks in a timely fashion, performing development tasks and tool operation, and improving specific process development knowledge and skills.

·       Lead and perform hands-on RIE/dry etch process development.  This includes performing customer demonstrations, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. 

·       Lead and perform etch process development to support productivity programs related to meeting the targeted customer specifications. This includes interacting with the customer to understand needs, making process and dry clean adjustments, and achieving defectivity and process stability specs.

·       Utilize analytical tools & techniques to solve process development issues.

·       Analysis of data, design and execution of experiments including DOE.

·       Must be able to operate Hitachi plasma etch systems and train new engineers in the use of these toolsets.

·       Must be able to operate all associated semiconductor metrology equipment utilized in the demo lab and be able to train new engineers in their use. 

·       Must be able to independently complete process development tasks with minimal instructions. Should be able to manage one or more projects/demos with limited support from Senior Engineers.

·       Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.

·       Lead and drive customer discussions regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.

·       Interface with Hitachi Corporate R&D headquarters in Japan.

 


Qualifications

EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS
BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, related field, or equivalent experience.  

EXPERIENCE AND TRAVEL REQUIREMENTS
5-10 years Plasma Etch Process Experience or semiconductor processing preferred.
Possible travel to Japan for training or customer sites worldwide as needed

SKILLS AND ABILITIES REQUIREMENTS
Must be willing to travel to Japan for project and process development programs.  
Periodic oversees business trips may be required throughout the year.
Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well in a team environment.
Strong general technical knowledge of semiconductor wafer processing. 
Advanced understanding of and experience with Dry Etch / RIE.
Self-motivated and show ability to adapt to changes in a fast moving environment.
Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
Strong engineering analytical/problem solving skills.  Understanding of Scientific Method and experience using it.
In depth knowledge of Design of Experiments (DOE).
Ability to work in teams in leadership and subordinate roles.  Supervise new hires and provide basic training and guidance.
Must be able to work in a clean room environment for extended hours. 
Oversee some of the logistics of the demo lab like: tacky mats, LN2 fill, clean room garments pick up and drop off, miscellaneous supply needs, and occasional delivery or pickup of demo lab parts or wafers. 
Should be able to manage some scheduling of resources.  Both human and equipment. 
Research, create and submit purchase orders for materials and services 
Strong computer skills including Microsoft Office software competency.

Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities
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