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Process Engineer I

Location: Hillsboro, Oregon, United States
Job ID: 45384
Date Posted: Apr 15, 2020
Segment: High-Tech
Business Unit: Hitachi High-Technologies
Company Name: Hitachi High-Tech America, Inc.
Profession (Job Category): Engineering
Job Type (Experience Level): New Graduate
Job Schedule: Full-time
Remote: No

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The Process Engineer I position is located in Hillsboro, OR and supports the business objectives of HTA’s Semiconductor Equipment Division (SED).  This positions main objective is to provide process engineering support to the Portland Research and Development (PRD) group, and related programs.  The employee must be willing to travel to Japan for a 0-2 year training assignment if necessary.  After a period of training the Engineer is expected to independently perform laboratory tasks, understand RIE theory, gas phase chemistry, and interface with customer engineers on a detailed level. Continued training will be available to develop specific skills, knowledge and service techniques.  The Engineer is also interfacing with engineers globally so strong interpersonal skills are required.
  • Hands-on dry etch equipment development.  Frequent use of prototype system sub-components which require performance characterization, and authoring of operation and safety procedures.
  • Hands-on dry etch process development.  This includes performing customer demonstrations, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. 
  • Operate Hitachi Etch Systems after being trained.
  • After training, must be able to operate all associated semiconductor metrology equipment including scanning electron microscopy, focused ion beam milling, and thin film metrology techniques. 
  • Working under limited supervision, must be able to independently complete routine process development tasks after receiving experimental goals.
  • Utilize analytical tools & techniques to solve process development issues.
  • Statistical analysis of data, design and execution of experiments including DOE.
  • Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.
  • Interface with customers and suppliers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues. 
  • Interface with Hitachi Corporate R&D headquarters in Japan.




  • BS or MS Degree in Chemistry, Chemical Engineering, Materials Science, a related Science/Engineering field, or equivalent experience. 



  • 0-5 years Plasma Etch Process, semiconductor processing, or graduate level laboratory experience beneficial.
  • Possible travel to Japan for training or customer sites worldwide as needed 




·         Must be willing to travel to Japan for 0-1 year training assignment. 

·         Periodic oversees business trips may be required throughout the year.

·         Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well individually and in a team environment.

·         General technical knowledge of semiconductor wafer processing.

·         Self-motivated and show ability to adapt to changes in a fast moving environment.

·         Demonstrate project planning, and execution, with on-time delivery of milestones.

·         Strong engineering analytical/problem solving skills.  Understanding of Scientific Method and experience using it.

·         Ability to operate safely, with limited supervision, in a complex laboratory environment

·         Ability to work in teams in leadership and subordinate roles.

·         Must be able to work in a clean room environment for extended hours.

·         Support research proposal creation and submittal.

·         Strong computer skills including Microsoft Office software competency.


Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities

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