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Software Engineer II

Location: Hillsboro, Oregon, United States
Job ID: 46054
Date Posted: Nov 6, 2020
Segment: Smart Life
Business Unit: Hitachi High-Technologies
Company Name: Hitachi High-Tech America, Inc.
Profession (Job Category): Engineering
Job Type (Experience Level): Experienced
Job Schedule: Full-time
Remote: No

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Description

Job Description Summary

 

The Software Engineer II position is located in Hillsboro, OR and supports the business objectives of HTA’s Semiconductor Equipment Division. The position anticipates in the conceptualization, modeling, analysis, development, documentation, and test/validation of software associated with new semiconductor plasma etching and ashing tool. The main objective is to designs, develops, and analyzes Software systems, equipment and packaging for etching system. Conducts feasibility studies and testing on new and modified designs. Develop and execute test plans that generate characterization data sufficient to understand and validate the performance of the design. Develop and present reports/presentations of excellent quality that communicate design intent, analysis, and validation at design reviews. The position will use C, C++, C#, VB, Excel, JMP, Python, and other specific software tools on its analysis and development works.

Qualifications

PRIMARY RESPONSIBILITIES


•Ensure successful technical relationship with customers for all etch and ash development and support activities;
•Identify potential design improvement items through communication with customers, and provide proposals and blueprint designs;
•Design new customer requests and features in our existing application with the support of management;
•Work with software engineering members to decide on specifications for software requirement alignments, software quality control, and minor software changes;
•Demonstrating solutions by providing documentation, flowcharts, and clear code;
•Generate internal and external documentation for products, presentations, and technical reports;
•Liaise with the service group to analyze equipment maintenance process and propose innovative improvement ideas;
•Monitor day-to-day relationships with customers for ongoing developments, and establish metrics to analyze and track performance with the support of management;
•Build computer aided design system in PEC site to access the factory master design system through communication with design engineers; and Participate and support activities with customers for new designs and new products;
•Operate plasma etch equipment and tools relating to the equipment in order to evaluate algorithm, software and system; and
•Other duties as required


EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS

 
B.S., M.S, or Ph.D.  in Software engineering, electrical engineering, mechanical engineering, computer science, mathematics, statistics, physics, chemistry, chemical engineering, or material science or an equivalent combination of education and experience

 

EXPERIENCE AND TRAVEL REQUIREMENTS

 

Should have a minimum of 2 years software development or design experience Trouble shooting experience for the embedded system a plus Knowledge of semiconductor manufacture tool design a plus Must be willing to travel domestically and internationally approximately 5% of the time including assignments that require multiple weeks stay Must be willing to live abroad on international assignments that typically last three months’ time or less

 

KNOWLEDGE, SKILLS, and/or ABILITIES REQUIREMENTS

 

•Knowledge of design and development for Software system, modular design, data structures and algorithms
•Knowledge of programming environments such as Visual Studio, Matlab, Python, R, C or equivalent systems/programs
•Knowledge of communication protocols GEM, GEM300, SECS, I2C, SPI, UART etc,
•Knowledge of Object Oriented Software implementation and development
•Knowledge of  TCP/IP
•Experience of real-time operating systems
•Knowledge of plasma dry etching or semiconductor processing preferred
•Strong Engineering analytical and problem solving skills
•General technical knowledge of semiconductor wafer processing.
•General technical knowledge of semiconductor manufacturing equipment.
•Strong motivation to learn technical knowledge of plasma etch equipment.
•Understanding of scientific methods
•Self-motivated and ability to adapt to changes in a fast moving environment.
•Ability to take R&D initiative and deliver tangible results under deadlines.
•Ability to work independently and inquisitively with minimal direction.
•Excellent teamwork and customer focus.
•Flexibility to work across all functions/levels as part of a team.
•Candidate must have excellent verbal and written communication skills with the ability to effectively communicate technical analyses and results.
•Ability to work in a clean room environment for extended hours.
•Strong computer skills including Microsoft Office software competency.

 

Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities

 


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