Process Engineer I

Description

HITACHI HIGH-TECH AMERICA, INC.

POSITION DESCRIPTION

POSITION TITLE:                             Process Engineer I

DIV/DEPARTMENT NAME:           Semiconductor Equipment Division (SED)

REPORTS TO:                                   Supervisor, Process Engineering

POSITION STATUS:                         Full-Time

WORK LOCATION:                         Hillsboro, OR (PEC)

WORK STYLE DESTINATION:     Hybrid (+50% Onsite)          

FLSA STATUS (E or N):                   Exempt

TRAVEL REQUIRED:                     5%

POSITIONS SUPERVISED:             None

HTA requires all employees to be fully vaccinated against COVID-19.  All new hires will be required to provide proof of their vaccination status prior to their start date and will need to receive the second dose of the Pfizer or Moderna vaccine or the single dose of the Johnson & Johnson vaccine on or before January 4, 2022, or no later than two weeks prior to their start date with HTA, unless they request and receive a medical or religious accommodation.

The Process Engineer I position is located in Portland, Oregon and supports the business objectives of HTA’s Semiconductor Equipment Division (SED).  The main objective of this position is to provide process engineering support to SED’s various demonstration labs, customer activities, and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes.  This is a developmental position where the engineer is expected to acquire job skills, learn company policies and procedures, perform routine tasks, enhance process development skills and acquire hardware proficiency.  Continued training will be given to develop specific skills and knowledge.  The employee must be willing to travel to Japan for a 1-3 month training assignment if necessary.  The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level within 3 years.  The engineer is also interfacing with engineers globally so strong interpersonal skills are required.

PRIMARY RESPONSIBILITIES

• Day-to-Day responsibilities include: completing assigned tasks in a timely fashion, learning routine development tasks and tool operation, and acquiring specific process development knowledge and skills.
• Perform hands-on RIE/dry etch process development.  This includes performing customer demonstrations, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. 
• Perform etch process development to support productivity programs related to meeting the targeted customer specifications. This includes interacting with the customer to understand needs, making process and dry clean adjustments, and achieving defectivity and process stability specs.
• Utilize analytical tools & techniques to solve process development issues.
• Analysis of data, design and execution of experiments including DOE.
• After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including scanning electron microscopy, focused ion beam milling, and thin film metrology techniques. 
• Working under supervision, must be able to complete process development tasks after receiving instructions.
• Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.
• Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.

• BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, related field, or equivalent experience. 

• 0-5 years Plasma Etch Process Experience or semiconductor processing preferred.
• Possible travel to Japan for training or customer sites worldwide as needed

• Must be willing to travel to Japan for 0-2 year training assignment. 
• Periodic oversees business trips may be required throughout the year.
• Strong general technical knowledge of semiconductor wafer processing.
• Fundamental understanding of and experience with Dry Etch / RIE.
• Self-motivated and show ability to adapt to changes in a fast moving environment.
• Strong knowledge of chemistry, the ability to analyze OES data, and utilize other predictive software is required.
• Strong engineering analytical/problem solving skills.  Understanding of scientific method and experience using it.
• In depth knowledge of Design of Experiments (DOE).
• Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well in a team environment.
• Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
• Ability to work in teams in leadership and subordinate roles.
• Must be able to work in a clean room environment for extended hours.
• Oversee some of the logistics of the demo lab like: tacky mats, LN2 fill, clean room garments pick up and drop off, miscellaneous supply needs, and occasional delivery or pickup of demo lab parts or wafers.
• Research, create and submit purchase orders for materials and services
• Strong computer skills including Microsoft Office software competency.

• Job related Knowledge Wire training
• Additional training to handle acids, bases or gases used for dry etching as needed

• Gases (toxic and non toxic) and handling of wet chemicals for sample preparation and analysis such as dilute HF

Warning:  Due to the nature of the work environment, this job may require working on equipment or in work areas where electromagnetic frequencies may be present from some of the equipment (intensity may vary) which could possibly interfere with certain medical implants or devices. If you have questions, contact Human Resources.

• Clean room attire
• Safety glasses or equivalent
• Chemical gear to handle wet chemicals along with hood operation
   

PHYSICAL AND MENTAL REQUIREMENTS

Physical Abilities Lift /Carry

O____ Stand

O____ Walk

F____ Sit 

O____ Handling / Fingering 

O____ Reach Above Shoulder

O____ Climb or Crawl

O____ Squat or Kneel

Lifting or Moving

O___ 10 lbs or less

O____ 11-20 lbs

O____ 21-50 lbs

N____ 51-100 lbs

N____ Over 100 lbs

Maximum one person weight lift of no more than 50 pounds under ideal conditions. Requires at least a two-man lift or more if lifting conditions are not ideal or more than 50 pounds, unless lifting device is used that can reduce the load to a safe level.

Push / Pull

O____ 12 lbs or less

O____ 13-25 lbs.

O____ 26-40 lbs

N____ 41-100 lbs

Other:

N (Not Applicable) Activity is not applicable to this occupation.

O (Occasionally) Occupation requires this activity up to 33% of the time (0 - 2.5+ hrs/day)

F (Frequently) Occupation requires this activity from 33% - 66% of the time (2.5 - 5.5+ hrs/day)

C (Constantly) Occupation requires this activity more than 66% of the time (5.5+ hrs/day)

________________

The above job description has been designed to indicate the general nature and level of work performed by employees with this classification.  It is not designed to contain or be interpreted as a comprehensive inventory of all duties, responsibilities and qualifications required of employees assigned to this job.

Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities

If you require reasonable accommodation in completing this application, interviewing, completing any pre-employment testing, or otherwise participating in the employee selection process, please direct your inquiries to [email protected]